Brand Name: HK CT TECH OEM PCB
Model Number: Double sided,Multilayer pcb
Copper Thickness: 0.1oz-8oz
Board Thickness: 0.2mm-4mm
Min. Hole Size: 0.1mm-1mm
Min. Line Width: 3mil-10mil
Surface Finishing: HASL,LEAD FREE HASL,OSP
Product name: CT TECH prototype design service pcb circuit boards
PCB type: Customized Electronics Manufacturing
Optional laminate material: alu/Aluminum,FR4/FR-4,Copper,Ceramic,Rogers
Solder mask color: Blue,Red,Purple,Yellow,White,Green,Black
Number of Layer: 2 layer,8 layer,multi-layer PCBB
Certification of quantum board led: ISO/UL/TS16949/RoHS/TS16949
PCB Standards: IPC-A-610 D/IPC-III Standard
Service: PCBA,PCB&PC, DIP, SMT
PCB fabrication FAQ:
Layering is a difficult problem to solve for PCB. The main reasons are as following:
(1) Improper packaging or improper preservation make PCBs damp;
(2) Storage time exceeding the valid storage period make the PCB board damp.
(3) Bad quality materials from PCB Suppliers or the process of bare printed circuit board have issues.
(4) The design of pcb board and the copper surface distribution on the pcb are not good.
PCB processing capability
| PCB service | Process capability |
| Layer | 1-20 layers |
| Maximum size | ≤600*500mm |
| Thickness | 0.1-5.0mm |
| Wire copper foil thickness | 17-343um（10oz） |
| Minimum linewidth / line distance | 0.075/0.065mm（3mil/2.8mil） |
| Minimum aperture | 0.15mm（6mil） |
| Minimum welding pad | 0.2mm（8mil） |
| Impedance control | +/-10% |
| Shape processing accuracy | +/-0.10mm（4mil） |
| Board type | FR-4, aluminum - base, copper -base, ROGERS, ARLON, Teflon, composite |
| Surface treatment | Tin spray, ENIG, Immerse Au, immersion silver, im mersion tin, osp, gold osp, electrospray tin |
PCB ASSEMBLY CAPABILITY
| SMT service | Process capability |
| Processing type | SMT, DIP, After welding, test |
| Maximum board | L50×W50mm～L510×W460mm |
| Maximum thickness | 3mm |
| Minimum thickness | 0.5mm |
| Minimum component | 1005 |
| Maximum component size | 150mm*150mm |
| Minimum pin component spacing | 0.3mm |
| Minimum bga spacing | 0.3mm |
| Maximum component mounting accuracy(100FP) | Whole assembly accuracy up to ±50 micron,whole process repetition accuracy ±30 micron. |
| SMT capacity | 4 million pins / day |
| DIP capacity | 100 thousand/ day |
