1) Thickness: 0.1mm-5mm
2) Minimum linewidth：0.075mm/3mil
3) Minimum gap：0.065/2.8mil
4) Minimum aperture inradium：0.15mm
5) Minimum aperture external diameter：0.45mm
6) Minimum BGA: 0.2mm
7) Layer：6 layers through hole non-impedance
8) PCB Assembly process: DIP, SMT, PCB Assembly
9) Item: PCBA Electronic
10) Material: Rogers; FR-4; high Tg/CTI/TD; high frequency; thick copper
All multilayer boards are printed with 36t screen, the resistance welding oil is 50 tons thicker than the traditional 43t, which provides reliability guarantee for the bga and more precise fine lines.
PCB fabrication FAQ
How the poor plug hole happen?
The poor plug hole is mainly caused by the lack of technical ability or simplification of the process in PCB factory, which is characterized by insufficient plug hole and open copper or false open copper in the hole ring. It may lead to insufficient solder content, short circuit with patch or pcb assembly device, residual impurities in the hole and so on. The appearance inspection of this problem can be found, so it can be controlled in the feed inspection and require the PCB factory to improve.
PCB processing capability
| PCB service | Process capability |
| Layer | 1-20 layers |
| Maximum size | ≤600*500mm |
| Thickness | 0.1-5.0mm |
| Wire copper foil thickness | 17-343um（10oz） |
| Minimum linewidth / line distance | 0.075/0.065mm（3mil/2.8mil） |
| Minimum aperture | 0.15mm（6mil） |
| Minimum welding pad | 0.2mm（8mil） |
| Impedance control | +/-10% |
| Shape processing accuracy | +/-0.10mm（4mil） |
| Board type | FR-4, aluminum - base, copper -base, ROGERS, ARLON, Teflon, composite |
| Surface treatment | Tin spray, ENIG, Immerse Au, immersion silver, im mersion tin, osp, gold osp, electrospray tin |
PCB ASSEMBLY CAPABILITY
| SMT service | Process capability |
| Processing type | SMT, DIP, After welding, test |
| Maximum board | L50×W50mm～L510×W460mm |
| Maximum thickness | 3mm |
| Minimum thickness | 0.5mm |
| Minimum component | 1005 |
| Maximum component size | 150mm*150mm |
| Minimum pin component spacing | 0.3mm |
| Minimum bga spacing | 0.3mm |
| Maximum component mounting accuracy(100FP) | Whole assembly accuracy up to ±50 micron,whole process repetition accuracy ±30 micron. |
| SMT capacity | 4 million pins / day |
| DIP capacity | 100 thousand/ day |
