Place of Origin: Guangdong, China (Mainland)
Brand Name: HKCT TECH OEM PCB
Model Number: FR-4 TG130/150/170 multi pcb
Base Material: Fr-4 TG130/150/170
Copper Thickness: 1oz-2oz
Board Thickness: 7mm
Min. Hole Size: 0.15mm, 0.20mm
Surface Finishing: HASL,LEAD FREE HASL,OSP
Product name: Factory price high TG Fr4 Metal Alu Small Printed Circuit Board
PCB type: Electronics Manufacturing
Number of Layer: Double Layer PCB,Multilayer PCB
Certification of quantum board led: ISO,SGS,ISO,ROHS
Testing service: Omron AOI/X-Ray/ICT/Solder Paste Testing/Function Testing
Service: PCBA,PCB&PCBA Design&Clone&Production
Application: Consumer Electronics,Industrial,Electronical Products,Battery Pack
PCB Assembly service: SMT THT DIP
PCB fabrication FAQ:
How to avoid BGA solder voids happen？
BGA solder voids may cause the dysfunction of main chip, and may not be found in the test. The hidden risk is high. So now many pcb assembly factories will check it by X-RAY machine.
This type of defect may occur due to residual liquid or impurities in the PCB hole get vaporization after high temperature, or poor laser hole on the BGA pad. Therefore, many HDI boards require plating holes or semi-filled holes to avoid this problem.
PCB processing capability
| PCB service | Process capability |
| Layer | 1-20 layers |
| Maximum size | ≤600*500mm |
| Thickness | 0.1-5.0mm |
| Wire copper foil thickness | 17-343um（10oz） |
| Minimum linewidth / line distance | 0.075/0.065mm（3mil/2.8mil） |
| Minimum aperture | 0.15mm（6mil） |
| Minimum welding pad | 0.2mm（8mil） |
| Impedance control | +/-10% |
| Shape processing accuracy | +/-0.10mm（4mil） |
| Board type | FR-4, aluminum - base, copper -base, ROGERS, ARLON, Teflon, composite |
| Surface treatment | Tin spray, ENIG, Immerse Au, immersion silver, im mersion tin, osp, gold osp, electrospray tin |
PCB ASSEMBLY CAPABILITY
| SMT service | Process capability |
| Processing type | SMT, DIP, After welding, test |
| Maximum board | L50×W50mm～L510×W460mm |
| Maximum thickness | 3mm |
| Minimum thickness | 0.5mm |
| Minimum component | 1005 |
| Maximum component size | 150mm*150mm |
| Minimum pin component spacing | 0.3mm |
| Minimum bga spacing | 0.3mm |
| Maximum component mounting accuracy(100FP) | Whole assembly accuracy up to ±50 micron,whole process repetition accuracy ±30 micron. |
| SMT capacity | 4 million pins / day |
| DIP capacity | 100 thousand/ day |
