Brand Name: HK CT TECH
Model Number: OEM PCB design
Base Material: fr-4 flex-rigid pcb board, Fr-4,ALu,Roger,leadfree
Copper Thickness: 1oz
Board Thickness: 1.6mm
Surface Finishing: imersion gold
Product name: HK CTT Quick Prototype Power Printed Circuit Board
Function: PCBA Board Service Prototype PCB Assembly
surface finishing: imersion gold/tin/Au/silver/tin,Osp,Hasl
Application: Consumer Electronics
Solder mask color: Green\White\Red\Blue\Black
PCBA type: Electronics Manufacturing board
Layer: 1-48 Layers (include Rigid-Flex PCB)
PCB fabrication FAQ:
Scratches, exposed copper issues of bare printed circuit board.
These defects test the management system and execution of PCB manufacturers. This problem is serious because it does bring about quality concerns. Many PCB factories say that this problem is difficult to improve. Actually it is not so difficult to improve, it depends on how much the circuit board manufacturing want to change! The DPPM has been significantly improved in all PCB factories that are serious about promoting the project.
PCB processing capability
| PCB service | Process capability |
| Layer | 1-20 layers |
| Maximum size | ≤600*500mm |
| Thickness | 0.1-5.0mm |
| Wire copper foil thickness | 17-343um（10oz） |
| Minimum linewidth / line distance | 0.075/0.065mm（3mil/2.8mil） |
| Minimum aperture | 0.15mm（6mil） |
| Minimum welding pad | 0.2mm（8mil） |
| Impedance control | +/-10% |
| Shape processing accuracy | +/-0.10mm（4mil） |
| Board type | FR-4, aluminum - base, copper -base, ROGERS, ARLON, Teflon, composite |
| Surface treatment | Tin spray, ENIG, Immerse Au, immersion silver, im mersion tin, osp, gold osp, electrospray tin |
PCB ASSEMBLY CAPABILITY
| SMT service | Process capability |
| Processing type | SMT, DIP, After welding, test |
| Maximum board | L50×W50mm～L510×W460mm |
| Maximum thickness | 3mm |
| Minimum thickness | 0.5mm |
| Minimum component | 1005 |
| Maximum component size | 150mm*150mm |
| Minimum pin component spacing | 0.3mm |
| Minimum bga spacing | 0.3mm |
| Maximum component mounting accuracy(100FP) | Whole assembly accuracy up to ±50 micron,whole process repetition accuracy ±30 micron. |
| SMT capacity | 4 million pins / day |
| DIP capacity | 100 thousand/ day |
