Packaging Of SMT Surface Mount Components

The packaging method of surface assembly components has become an important link in SMT system. It directly affects the efficiency of assembly and production, and must be optimized in combination with the type and number of SMT feeder. There are four main types of packaging for surface-assembled components: braided, tubular, pallet and bulk. Mass production, it is recommended to choose the form of express braid packaging; Low production or prototype production, pipe installation is recommended; Bulk is rarely used as the bulk must be picked up one by one or repackaged with assembly equipment. The following patch processing plant technicians from Electric Circuit Board Assembly Manufacturer talk about what kind of packaging.

1. Braid packaging

Braided packaging is the most widely used, the longest time, strong adaptability, high efficiency of a form of packaging, and has been standardized. All components except QFP, PLCC and LCCC are packaged in this way. Braid packaging used braid mainly paper, plastic bags and three types of adhesive tape. Paper tape is mainly used for packaging sheet resistance, capacitance; Plastic bags are used for packing various kinds of sheet components such as pin free components, composite components, special-shaped components, SOT, SOP, small size QFP, etc.

2. Tube packing

Tube type packaging is mainly used to package rectangular chip resistance, capacitance, some special shape and small devices, mainly used for SMT components variety and small batch occasions. When packaging, the components are overlapped in the same direction and then loaded into the plastic tube once (generally 100 ~ 200 pieces/tube). The two ends of the tube are inserted into the feeder of the SMT machine with a stop bolt. The cover of the mounting box is removed.

For the Custom PCB Assembly ,the cost of tubular packaging materials is high and the number of packaged components is limited. At the same time, if the mounting pressure of each tube is not balanced, the components are easy to get stuck in the narrow tube. However, for surface assembly IC, the cost of tube packaging is lower than pallet packaging, but the speed of binding is not as fast as the braiding method.

3. Pallet packaging

Tray packaging is to use rectangular partition to make the tray according to the provisions of the cavity, and then the components one by one into the plate, the general 50 / plate, cover the protective film. Pallet has a single layer, three layers, ten layers, twelve layers, twenty-four layers of automatic feed tray feeder. When this packaging method is applied, it is mainly used to package medium, high and multi-layer ceramic capacitors with large shape. At present, it is also used to package SOP, QTP and other components with large number of pins.

Tray packaging tray has hard disk and floppy disk points. The hard disk is often used to package QTP components with multiple pins and fine spacing, so that the lead wire of the package body is not easy to deform. The floppy disk is used to package common special-shaped chip components.