Service and Support
Process Capability
| PCB service | Process capability | ||
|---|---|---|---|
| Layer | 1-20 layers | ||
| Maximum size | ≤600*500mm | ||
| Thickness | 0.1-5.0mm | ||
| Wire copper foil thickness | 17-343um（10oz） | ||
| Minimum linewidth / line distance | 0.075/0.065mm（3mil/2.8mil） | ||
| Minimum aperture | 0.15mm（6mil） | ||
| Minimum welding pad | 0.2mm（8mil） | ||
| Impedance control | +/-10% | ||
| Shape processing accuracy | +/-0.10mm（4mil） | ||
| Board type | FR-4, aluminum - base, copper - base, ROGERS, ARLON, Teflon, composite | ||
| Surface treatment | Tin spray, ENIG, Immerse Au, immersion silver, immersion tin, osp, gold osp, electrospray tin |
| SMT service | Process capability | |||
|---|---|---|---|---|
| Processing type | SMT, DIP, After welding, test | |||
| Maximum board | L50×W50mm～L510×W460mm | |||
| Maximum thickness | 3mm | |||
| Minimum thickness | 0.5mm | |||
| Minimum component | 01005 | |||
| Maximum component size | 150mm*150mm | |||
| Minimum pin component spacing | 0.3mm | |||
| Minimum bga spacing | 0.3mm | |||
| Maximum component mounting accuracy(100FP) | Whole assembly accuracy up to ±50 micron,whole process repetition accuracy ±30 micron. | |||
| SMT capacity | 4 million pins / day | |||
| DIP capacity | 100 thousand/ day | |||
What We Do
PCB production, PCBA production, components purchasing, testing, finished products assembly, aging test, packaging.
Production Service
Low threshold
1 sample order acceptable, support bulk components process
Low costs
Our own factory to control the cost of the whole process, only earn processing fees
Fast delivery time
High production capacity, can support rapid delivery, the fastest sample time could be 24 hours
More convenient
Our own PCB factory and PCBA factory, can do material purchasing, finished product assembly, aging test. Solve all of your troubles of production
More assured
We passed ISO9001, UL, TS16949, ROHS and other certifications to make production and products more safer
